Deposition of thin films and surface modification by pulsed high energy densit

The use of pulsed high energy density plasma is a new low temperature plasma technology for material surface treatment and thin film deposition.We present detailed theoretical and experimental studies of the production mechanism and physical properties of the pulsed plasma.The basic physics of the pulsed plasmamaterial interaction has been investigated.Diagnostic measurements show that the pulsed plasma has a high electron temperature of 10—100eV,density of 1014—1016cm-3,translation velocity of ～107cm/s and power density of ～104W/cm2.Its use in material surface treatment combines the effects of laser surface treatment,electron beam treatment,shock wave bombardment,ion implantation,sputtering deposition and chemical vapor deposition.The metastable phase and other kinds of compounds can be produced on low temperature substrates.For thin film deposition,a high deposition ratio and strong film to substrate adhesion can be achieved.The thin film deposition and material surface modification by the pulsed plasma and related physical mechanism have been investigated.Thin film cBN,Ti(CN),TiN,DLC and AlN materials have been produced successfully on various substrates at room temperature.A wide interface layer exists between film and substrate,resulting in strong adhesion.Metal surface properties can be improved greatly by using this kind of treatment.