等离子体刻蚀工艺的物理基础

The physics of plasma etching

摘要: 介绍了等离子体刻蚀工艺背景以及有关等离子体刻蚀机理的研究进展，综述了等离子体刻蚀机理的研究方法，着重阐述了电容耦合放电和电感耦合放电等离子体物理特性，特别是双频电容耦合放电等离子体和等离子体鞘层研究中的关键问题.
- 等离子体 /
- 刻蚀 /
- 电容耦合放电 /
- 电感耦合放电 /
- 双频 /
- 鞘层
Abstract: The background and progress in the development ofplasma etching processes are reviewed. Studies of the mechanism of capacitively- and inductively-coupled discharges are discussed, especially the key problems of dual frequency capacitively-coupled discharge and plasma sheaths.
- plasma /
- etching /
- capacitively\ /
- coupled discharge /
- inductively\ /
- coupled discharge

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